金刚石/铜复合导热材料的界面结构研究

The research on the interfacial structure of diamond-copper thermally conductive composites

本文采用FIB手段制备出金刚石/铜复合材料的截面样品,并利用SAED、EELS和HRTEM对金刚石-镀层界面处的结构和化学成分进行研究。结果表明:在热处理过程中,金刚石中的碳原子扩散至硼镀层中生成了B4C相;镀层中的B原子扩散至金刚石衬底中,其扩散深度为22.81nm。这两种元素的互扩散提高了金刚石和硼镀层的界面结合强度,有利于提高复合材料的导热性能。

In this paper, the cross section samples of diamond-copper composites were prepared by FIB, and the structure and chemical composition between the diamond and coating were studied through SAED,EELS and HRTEM. The results show that during the process of heat treatment,the carbon atoms in the diamond diffused into the boron coating and formed the B4C phase. The B atoms in the coating diffused into the diamond substrate,and the diffusion depth was 22. 81nm. The interdiffusion of B and C atoms improves the interfacial strength between diamond and boron coating,and thus enhances the thermal conductivity of the composites.