芯片堆叠的焊接生产工艺探讨

Brief Discussion on the Welding Production Technology of Chip Stacking

芯片堆叠焊接技术是人们在SMT贴片生产领域中研发一种芯片与芯片全新贴装封装概念，它是在芯片上放置芯片，此项技术可以提高逻辑运算功能和存储空间。本文探讨了芯片2层堆叠焊接。

Welding technology of chip stacking is a new concept of chip mount and packaging technology developed in SMT field, which means chip-on-chip. It can improve the logic operation function and storage space. This paper has briefly discussed the 2- layer chip stacking welding technology.