Sn-Pb焊点金脆失效行为研究进展评述

Review of Research Progress on Gold Embrittlement Failure Behavior of SnPb Solder Joints

随着大量细间距、高密度的BGA或QFN等器件在复合基板或高频微波板镀金焊盘上应用,SnPb焊点金脆失效行为已成为航天产品制造必须考虑的问题。针对当前航天产品电气互联过程中含金焊点失效问题,从镀金层搪锡去金处理的标准要求、产生金脆含金量、金脆失效行为的界面反应行为等方面对国内外研究现状、动态进行了分析和评述,并结合航天产品的应用环境,提出了今后金脆失效行为的研究重点和方向。

With the application of a large number of fine pitch and high-density BGA or QFN devices are used on composite substrates or high frequency microwave board with gold-plated pads,the embrittlement failure behavior of SnPb solder joints has become an problem that must be considered in the manufacture of aerospace products. Aiming at the current problems of solder joint failure in electrical interconnection of aerospace products,analyzed and reviewed the domestic and overseas research status on gold embrittlement failure behavior of SnPb solder joints from the respects of the standard requirements of removing gold from Gold plating with tin coating,Gold content of causing gold embrittlement,Interfacial reaction behavior of gold embrittlement and so on. The research focus and direction of gold brittleness failure behavior in the future are proposed combining with the application environment of aerospace products.