低温共烧陶瓷基板大面积锡铅可焊性研究

Research on Solderability of Large Area SnPb Soldering of Low Temperature Co-fired Ceramic Substitute

低温共烧陶瓷技术以小型化和高可靠性的优势被广泛地应用在微波通信、航空航天和军事电子等领域。基于LTCC技术的微波模块和系统可有效提高电路的封装密度及可靠性。然而在制作过程中发现,使用FerroA6M和金铂钯浆料CN36-020所制作的LTCC基板可焊性较差,影响后续器件与基板的焊接和贴装。通过实验分析了可焊性差的原因,并从LTCC基板制造关键工序着手,提出了优化基板可焊性的解决措施。

The low temperature co-fired ceramic with advantages of miniaturization and high reliability are widely used in the fields of microwave communication,aerospace and military electronics. The microwave module and system based on LTCC technology can effectively improve the packing density and reliability. However,in the process of fabrication,it is found that the LTCC substrate fabricated by using the Ferro A6 M and the CN36-020 material has poor solderability and affects the soldering and packaging of the subsequent devices and substrates. Analyzed the reasons of poor solderability by experiments,and proposed the solution of optimizing the solderability of substrate based on the key process of LTCC substrate manufacturing.