摘要
有铅工艺时代,PCB的表面处理主要是锡铅合金热风整平工艺(HASL),俗称喷锡铅。到了无铅工艺时代,常用的表面处理工艺有四种,即ENIG、Im-Ag、Im-Sn和OSP,它们各自有优势与不足,存在选用的问题。简要介绍了这四种表面处理的优缺点及适用的应用场景。
in the process of soldering with solder containing Pb,the surface treatment of PCB is mainly tin lead alloy hot air leveling process（HASL）,commonly known as spraying tin lead. In the process of soldering with lead-free technology,there are four kinds of surface treatment processes commonly used,namely ENIG,Im-Ag,Im-Sn and OSP. They have their own advantages and disadvantages,and there are problems in the selection. Briefly introduce the advantages and disadvantages of these four kinds of surface treatment and their suitable application.
出处
《电子工艺技术》
2017年第6期364-369,共6页
Electronics Process Technology
关键词
无铅
PCB
表面处理
lead-free
PCB
surface treatment
