摘要
通过对开关电源内部标准单元电路构成和内部元器件的特性分析研究,结合Si P技术,采用LTCC/HTCC工艺技术制作多层3D结构,实现开关电源电路中标准单元电路3D结构设计,有效提高了空间利用率,减小了体积。同时对该结构的热力载荷进行了可靠性分析,最后通过实际产品设计验证,证明Si P技术在开关电源中应用的可行性。
By means of studying characteristics of the inner standard unit circuit and the components of switchpower supplies with SiP technology, multiple three-dimensional structure was made by LTCC or HTCC techniques,fulfilling IP core circuit 3D structure design in switch power supplies with small size and high space efficiency.Meanwhile, the thermal and force loads reliabilities of this 3D structure were analyzed. Then the verification of an actualproduct design was passed, and the feasibility of SiP technologies in switch power supplies were testified.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2018年第1期66-70,共5页
Electronic Components And Materials
