焊接后印制电路板清洗方法研究

Study on the Method of Cleaning Post-welding Printed Circuit Board

当今的电子装配技术在运作速度和质量上比以往大有提高,电路走线更窄,装配的组件也更密集。为了保证产品在规定的工作环境下正常实现设计中的功能要求、达到所要求的最低时间或周期,焊后清洗技术在整个表面安装技术(SMT)的工艺中扮演着十分重要的角色。在介绍了清洗的重要性的基础上,通过对比手工清洗和溶剂气相清洗的效果,提出气相清洗是去除零件上有机污垢的更有效的清洁方法,此种方法甚至能去除焊接中遇到的最为顽固的污垢。在溶剂蒸汽清洗机中经过清洗的零件从机器中取出时是干燥的,而且表面无任何残留物,最佳地满足了焊接后印制电路板的清洗需求。

Contemporary electronic assembly technology is much better than ever before in terms of speed and quality, and has more narrow circuit wiring and more intensive components assembling. In order to ensure that these products work in accordance with the design requirements in the required environ-ment, and to achieve the minimum required time or cycle, the post -welding cleaning technology plays a very important role in the whole SMT（Surface Mount Technology） process. Based on the introduction to the importance of cleaning, and by comparing the effects between manual cleaning and solvent vapor cleaning, it is proposed that vapor cleaning is an effective cleaning method to remove organic dirt on the parts. This method can even remove the most stubborn fouling encountered in the welding operation. When taken out of the machine, the parts are dry and without any residue on the surface after the cleaning in the solvent steam cleaning machines, which can best meet the demand of the post-welding printed circuit board clean-ing.