期刊文献+

基于MCS51串口通讯在半导体电镀设备改善中的应用

Design of Serial Communication Module for Improvement of the Plating Equipment
下载PDF
导出
摘要 主要介绍了基于MCS51单片机为核心的开关量数据通讯模块,针对扁平电缆机械使用寿命所导致设备之故障,通过对单片机STC89C52的串口编程实现在半导体电镀设备的控制站与行车间的数据通讯,信号传输模式的改变减轻了线缆失效带来的不良影响。方案采用RS485全双工工作协议,稳定可靠,适合工业现场应用。此项目也是基于TPM设备管理理念的改善性维修项目,是由TPM团队对设备各失效现象统计和分析后,可节约电镀生产线上的线缆资源,提升设备的稳定性和生产效率,为今后TPM工作的推广指明了方向。 A c ommunica t ion module bas ed on MCS51 SCM for the digi t al swi tching was int roduc ed. For the failure of the equipment caused by the mechanical durability of the flat ribbon cable on the e-quipment, it was applied in the corrective project to eliminate the negative influence for the cable failure by changing the signal transfer mode. The design was realized for communication between the control sta-tion and the bridge crane of the semiconductor plating equipment through programming STC89C52 serial port. The communication interface solution is RS-485 full duplex operation that provides reliable and flexible connectivity services on the industrial field. The project was implemented as the corrective main-tenance under the guidance of Total Productive Maintenance (TPM). The TPM group establish the im-provement direction through the statistics of all kinds of the failure and the analysis of the equipment conditions. Implementation of the project saves a lot of the cable resource of the electroplating automatic production line,more importantly the performance of the improvement project has proved to be a success-ful operation in terms of decreasing the trouble rate and improvement of the machine's operating efficien-cy and reliability with TPM method. Points out the direction of further TPM work in the future.
作者 石巍
出处 《微处理机》 2017年第6期90-93,共4页 Microprocessors
关键词 单片机 串口 通讯 TPM体系 SCM Communication RS485 T PM
  • 相关文献

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部