摘要
利用Pro/E与ANSYS联合仿真,对不同材料、丝径、键合形式和跨度的键合丝的振动应力极限进行了分析研究。基于键合工艺及其特点在Pro/E中建立了键合丝参数化三维模型,并利用ANSYS对参数化模型进行了模态及随机振动仿真分析,获得了球键合金丝与楔键合硅铝丝在不同丝径、跨度等条件下的极限功率谱密度,研究结果可为键合丝的选型提供参考。
The vibration stress limit of bonding wires with different materials, wire diameter, different bonding form and different span is analyzed and studied the joint simulation with Pro/E and ANSYS. Based on the bonding process characteristics, the parametric 3D model of the bonding wire is established in Pro/E, different through and its and the simulation analysis of modal and random vibration are carried out for the parametric model by ANSYS. Therefore, the limit power spectral density of ball bonding alloy wire and wedge bonding silicon aluminum wire under different wire diameter and different span are obtained. And the research results can provide reference for the selection of bonding wire.
出处
《电子产品可靠性与环境试验》
2017年第6期24-28,共5页
Electronic Product Reliability and Environmental Testing
关键词
键合丝
随机振动
极限功率谱密度
仿真分析
bonding wire
random vibration
limit power spectral density
simulation analysis
