摘要
根据溅射余弦分布理论建立了平行溅射和斜溅射模型,计算了矩形磁控靶溅射和圆形磁控靶溅射的膜厚均匀性;讨论了各种溅射模式的膜厚均匀性趋势和优劣,为磁控溅射系统的设计布局提供了支撑。
The paralell sputtering and oblique sputtering models built up on cosine distributted theory are used to calculate the thickness uniformity of films deposited with rectanglar magnetron sputtering and circular magnetron sputtering. To aid the design and regulation of magnetron sputtering systems, the trend of thickness uniformity of films deposited with different magnetron sputtering methods as well as the advantages and disadvantages of different magnetron sputtering methods are then analyzed and discussed.
出处
《电子工业专用设备》
2017年第6期10-16,共7页
Equipment for Electronic Products Manufacturing
基金
湖南省自然科学基金资助项目(14JJ2142)
关键词
矩形靶
圆形靶
平行溅射
斜溅射
Rectangular target
Circular target
Paralell sputtering
Oblique sputtering
