FC测试编带产品芯片裂纹的预防

The FC of Products With Die Crack Prevention

介绍和讨论了FC测试编带产品在功能测试过程中引起芯片隐性裂纹的主要原因及预防措施。从转盘设备结构来分析(Feeding进料方式、测试结构、Z轴电动机下压和吸嘴压力等)都会引起芯片裂纹,导致IC在使用过程中电功能失效和可靠性低问题。只有了解了导致芯片裂纹的各种外界因素,半导体集成电路封装厂才能采取针对性的预防措施杜绝芯片裂纹这种致命的缺陷。

This paper mainly introduces and discusses the main reason and preventive action of the chip recessive cracks caused by FC braid products during function testing. The analysis of the structure of the rotary table （feeding mode, test structure, pressure of the Z-axis motor and suction pressure etc.） can lead to chip crack, resulting in IC in the process of using function failure and reliability of quality problems. Only to clarify the various factors leading to chip crack, the semiconductor factory can take targeted preventive to eliminate the fatal flaw of chip crack.