亚微米BiCMOS[B]芯片与制程剖面结构

Structure of Submicron BiCMOS[B] Chip and Process

亚微米BiCMOS[B]技术能够实现双极型与CMOS元器件兼容的工艺。为了便于集成,采用双极型制程为基础,引入CMOS元器件工艺,在同一硅衬底上实现兼容的BiCMOS[B]工艺。这是采用亚微米Bi CMOS[B]集成电路芯片结构设计、工艺与制造技术,依该技术得到了芯片制程结构。

Submicron Bi CMOS[B] technology can realize bipolar and CMOS components compatible process. In order to facilitate the integration, the CMOS process is introduced based on the bipolar process, and the compatible Bi CMOS[B] process is implemented on the same silicon substrate. This is a sub micron Bi CMOS[B] integrated circuit chip structure design, process and manufacturing technology, according to the technology to obtain the chip process structure.