温度对铜膜中间层W/CuCrZr热等静压焊接质量的影响

Effects of Hot Isostatic Pressing Joining Temperature on Copper Coating as the Interlayer

采用磁控溅射沉积40μm铜膜作为中间层,分别在950、980和1050℃下通过热等静压(HIP)焊接技术制备了国际热核聚变实验堆(ITER)计划W/CuCrZr偏滤器部件焊接模块,以考察温度对磁控溅射沉积40μm铜膜作为中间层W/CuCrZr偏滤器部件焊接质量的影响。通过扫描电子显微镜(SEM)和EDS能谱分析焊接界面的形貌和成分,利用超声波无损探伤(NDT)仪对焊接界面缺陷进行了检测,利用力学拉伸试验机考察了焊接界面的结合强度和CuCrZr合金的力学性能。结果表明:磁控溅射法沉积40μm铜膜作为中间层,可以有效地提高HIP焊接界面质量。特别是在980℃时,所制备的焊接模块能够满足ITER计划对于偏滤器部件连接性能的要求。

The international thermonuclear experimental reactor（ITER） project W-Cu divertor component model was made by a hot isostatic pressing（HIP） diffusion welding method under three HIP diffusion welding processes with the temperature of 950,980 and 1050 °C,and the model was studied by analyzing a module using the magnetron sputtering method to deposit a 40 μm-thick copper coating as the interlayer.This paper aimed to study the effect of the magnetron sputtering method to deposit a 40 μm-thick copper coating as the interlayer of W-Cu divertor component model properties.The morphology and composition of the tungsten and Cu-Cr-Zr alloy joints were investigated by SEM and EDS,the joint defects were detected by ultrasonic non-destructive testing（NDT） equipment,and the bond strength of joints were measured by mechanical tensile tester.The results show that a 40 μm-thick copper coating as the interlayer,which is deposited by the magnetron sputtering method,can significantly improve the properties of hot isostatic pressing joining.In particular,the welding module prepared at 980 °C meets fully the requirements of the ITER divertor.