摘要
碳纳米材料具有诸多独特的物理特性,如极大的热导率和载流容量.根据国际半导体技术发展路线图给出的预测,碳纳米材料可望取代传统硅和铜材料成为下一代集成电路的基础材料.本文针对碳纳米材料在无源电子器件方面的发展现状和应用前景,详细讨论了碳纳米管、石墨烯纳米带等碳基纳米互连结构的电学特性.进而,简要评述了片上电感、电容器等碳基高频无源器件,并介绍了碳纳米材料在集成电路热管理方面的应用.
Carbon nanomaterials have many unique physical properties, such as extremely large thermal conductivity and ampacity. According to the ITRS prediction, carbon nanomaterials are the most promising candidate to replace the conventional silicon and copper as the electronic materials of choice for the next-generation integrated circuits. In this paper, the present status and future prospect of carbon-based passive devices are reviewed. The characterization of carbon-based nanointerconnects,including carbon nanotube and graphene nano-ribbon,are discussed. Furthermore, the carbon-based high-frequency passive devices, including on-chip inductors and capacitors, are briefly introduced. The potential applications of carbon nanomaterials in the thermal management of ICs are also discussed.
出处
《电子学报》
EI
CAS
CSCD
北大核心
2017年第12期3037-3045,共9页
Acta Electronica Sinica
基金
国家自然科学基金(No.61411136003
No.61331006
No.61504033)
关键词
碳纳米管
石墨烯
铜-碳纳米材料
互连线
片上电感
变容器
散热器
carbon nanotube ( CNT )
graphene
copper-nanocarbon
interconnect
on-chip inductor
varactor
heat spreader