摘要
针对某电子设备出现的局部热流密度过高问题,提出了一种S型流道与翅片散热模块相结合的设计。利用ICEPAK仿真软件,分别对形状为矩形、梯形和三角形这三种内嵌翅片的S型流道进行热分析。同时,通过实验验证三种冷板的散热效果。研究显示:实验结果与仿真结果基本一致;翅片散热模块能明显改善冷板的散热性能;三角形翅片的散热效果最好,但在冷板表面均温性和流阻方面,梯形翅片的方案更优于其它两种翅片。在满足此次冷板热设计要求的前提下,综合分析比较,最终选择梯形翅片的S型流道结构。
The S-shaped flow channel combined with fin was introduced to cool the electronic equipment with the problem of high heat flux in local area ICEPAK simulation software was used for thermal analysis on three kinds of embedded-fin cooling plates whose cross sections were rectangle ,trapezium and triangle. At the sam* time, experiments were conducted on the three kinds of plates to test the cooling properties of them,which showed that the experimental conclusions agree with the simulation results.The fin heat dissipation module was proved a better performance on heat transfer of cooling plate. Among the three groups ,triangle fin performed the best; compared the other two fins, trapezium fin showed much superiority in surface temperature and flow resistance.In meeting the requirements of the cooling plate thermal design,the trapezium fin was chosen as the S-shaped flow channel structure after comprehensive analysis and comparison.
出处
《机械设计与制造》
北大核心
2018年第1期55-57,61,共4页
Machinery Design & Manufacture
基金
江苏省产学研联合创新资金-前瞻性联合研究项目资助(BY2014037-24)
关键词
冷板
散热性能
电子设备
优化设计
翅片
仿真分析
Cooling Plate
Heat Radiation
Electronic Equipment
Optimization Design
Fin
Simulation Analysis