摘要
利用活化后硅胶作为载体,Cu^(2+)为模板离子,γ-脲基丙基三甲氧基硅烷作为功能单体和偶联剂,以二甲基丙烯酸乙二醇酯和偶氮二异丁腈为交联剂和引发剂合成了硅胶活化铜离子表面印迹材料Cu(II)-IIP,并以此作为吸附剂进行静态吸附实验。结果表明,Cu(II)-IIP对于Cu(II)的吸附过程可用Langmuir等温吸附模型来描述,其吸附行为符合准2级动力学方程,即对Cu(II)的吸附过程以单层吸附为主。Cu(II)-IIP对Cu(II)的吸附在50 min可达到吸附平衡。当水中Cu(II)初始质量浓度为50 mg/L、p H为6、温度为40℃吸附平衡时吸附量达到最高,对Cu(II)最大吸附容量可达76.29 mg/g。
Activated silica gel, Cu2＋ and γ-ureidopropyltrimethoxysilane were used as carrier, template, functional monomer and coupling agent respectively to synthesize urea-functionalized copper ion surface imprinted polymer （Cu（II）-IIP）, EGDMA and AIBN was used as crosslinking agent and initiator respectively. Cu（II）-IIP was used as adsorbent to do the static adsorption experiment. The results showed that, Cu（Ii） adsorption process by Cu（II）-IIP could be described with Langmuir isothermal adsorption model, and it was fitted by pseudo-second-order kinetic equation, that was mainly monolayer adsorption. The adsorption equilibrium of Cu（II） adsorption by Cu（II）-IIP could be reached in 50 min. The maximum Cu（II） adsorption capacity could reach 76.29 mg/g when initial mass concentration of Cu（II）, pH and temperature was 50 mg/L, 6 and 40 ℃ respectively.
出处
《水处理技术》
CAS
CSCD
北大核心
2018年第1期33-37,共5页
Technology of Water Treatment
基金
山西省基础研究计划项目(2013011040-1)
