厚铜电路板的翘曲影响因素分析与改善

Analysis and improvement of warping factors of thick copper circuit board

PCB的板件平整度对电子元器件表面贴装至关重要。PCB的叠层结构、图形线路设计、制造工艺等影响因素,如设计不合理,都会导致不同程度的板翘。本文通过对厚铜PCB的翘曲问题案例分析,研究与实验厚铜PCB的翘曲影响因素并提出改善方向。

The flatness of the PCB is very important to the electronic components in SMT process. The stack-up, pattern design, manufacturing technology and other factors will also lead to different levels of warpage, if design is unreasonable. Through the analysis of heavy copper PCB warping problem case, this article studies and tests the affecting factors of the heavy copper PCB warpage problem, also comes up with improvementdirection.