锦纶基体表面以乙醛酸为还原剂的化学镀铜工艺

Technology of Electroless Copper Plating on the Surface of Poly Amide by Oxygenate

锦纶表面化学镀铜是实现金属化的重要途径。本文通过检测镀铜层沉积速度、镀层体积电阻等方法,研究了锦纶表面以乙醛酸为还原剂的化学镀铜工艺。实验结果表明,乙醛酸可以代替甲醛在锦纶织物表面得到光亮、致密、结合力好的化学镀铜金属层,镀液pH值及温度适当提高,镀速增大,镀层电阻减小,光亮度提高,亚铁氰化钾3 mg/L及2,2'-联吡啶的加入降低了镀速,但可以显著降低镀层电阻,表明添加剂的加入使镀层致密性增强。锦纶织物表面以乙醛酸为还原剂得到光亮稳定镀层的化学镀铜最佳配方及工艺:CuSO_4·5H_2O 10 g/L、乙醛酸3 g/L、酒石酸钾钠20 g/L、EDTA 40 g/L、NiSO_40.9 g/L、亚铁氰化钾3 mg/L、2,2'-联吡啶5 mg/L、聚乙二醇50 mg/L、pH值为13、温度为60℃。

Copper plating on poly amide surface is an important way to realize internalization. In this paper, the process of electroless copper plating on the surface of poly amide was studied by detecting the deposition rate and coating volume resistance. Experimental results show that the oxygenate can instead of formaldehyde in the nylon fabric surface light, compact and good bonding force chemical copper plating layer, pH and temperature of solution increasing, the speed increases, plating coating resistance decreases,and the brightness increased, potassium confederacy 3 mg/L and 2,2＇- the addition of joyriding reduces the plating speed,but can significantly reduce the coating resistance, suggests that boosting the coating compactness of additives, poly amide fiber fabric surface with logicality acid as reducing agent to get stable light coating of chemical copper plating： the best formula and process of CuS04.5H20 10 g/L,3 g/L logicality acid,20 g/L sodium potassium tart,40g/L EDTA ,NiSO4 0.9 g/L, potassium confederacy 3 rag/L,2,2＇- AL joyriding 5 mg/L,pelyethylene glycerin （peg） 50 mg/L,pH for 13, temperature of 60℃.