摘要
树脂薄片砂轮是以树脂为粘接剂,将松散的磨料粘结起来,固结呈一定厚度的薄片砂轮,其在半导体、航空航天等精磨切磨加工领域有着广泛应用。文章针对磨料薄片砂轮技术相关专利进行了分析。
Resin wafer grinding wheel is a kind of thin abrasive wheel, which solidiiies loose abrasive materials to a degree of thickness. It is widely used in semiconductor, aerospace and other fields of fine grinding and cutting grinding. In this paper, the patent of abrasive wafer grinding wheel is analyzed.
出处
《科技创新与应用》
2018年第4期5-6,共2页
Technology Innovation and Application
关键词
薄片砂轮
树脂
专利
wafer grinding wheel
resin
patent
