脉冲宽量对GCr15基体温升及其镀层结构与性能的影响

Effects of pulse width on temperature rising of GCr15 substrate and structure and properties of coating

采用离子镀技术于淬火态GCr15表面沉积Ti镀层,通过改变脉冲宽量,对GCr15基体温升进行控制。采用X射线衍射仪（XRD）、扫描电子显微镜（SEM）、显微硬度计、纳米压痕仪、洛氏硬度计、光学显微镜等研究脉冲宽量对镀层的微观组织及力学性能的影响。结果表明：脉冲电场模式下,脉冲宽量为2 ms时,基体温升得到有效控制,且随着脉冲宽量的增大,基体温升从40℃升高到275℃时,薄膜晶化程度增强,平均晶粒尺寸由10.1 nm增大至14.6 nm,硬度、弹性模量提高约50%,韧性降低约18%,膜基结合力降低。

Ti films were deposited on the surface of quenched GCr15 steel by ion plating technology, and the temperature rising of substrate were controlled by changing the pulse width. The effects of pulse width on structure and mechanical properties of the Ti films were analyzed by means of X-ray diffraction（XRD）, scanning electron microscopy（SEM） , microhardness test, nano-indenter, Rockwell apparatus and optical microscope. The results show that the temperature rising of the substrate can be effectively controlled when the pulse width is 2 ms. With the increasing of the pulse width, the temperature rising of the substrate increases from 40℃ to 275℃, the average grain size increases from 10. 1 nm to 14. 6 nm, the hardness and elastic modulus increase by 50% , the toughness reduces by 18% , and the bonding strength between the films and substrate decreases.