旋转状态下抑涡孔气膜冷却性能的实验研究

Experimental Investigation of Film Cooling Performance on a Rotating Model with Anti-Vortex Hole

为了获得旋转状态下抑涡孔的冷却性能,用稳态液晶测温的方法,对两种抑涡孔在吸力面和压力面上进行实验研究,分析吹风比和铺孔位置对气膜覆盖范围和气膜冷却效率的影响并与单个圆孔进行对比。实验参数为:转速600r/min,主流雷诺数3370,吹风比M从0.3到2.5。研究表明:两种平行式抑涡孔均具有优异的气膜冷却性能,相比单个圆孔,其气膜覆盖范围和冷却效率在吸力面和压力面均得到大幅提高;铺孔位置会对抑涡孔冷却性能产生重要影响,上游抑涡孔在M<1.5时表现最优,中游抑涡孔则具有很好的吹风比适应性,在M=2.5时表现最优;吸力面气膜覆盖范围和冷却效率均低于压力面,并且偏转趋势更明显。

In order to obtain the film cooling performance of anti-vortex hole under rotating condition,two anti-vortex holes were experimentally studied both on the pressure side and suction side by applying Thermochromic Liquid Crystal technique. The effects of blowing ratio and small hole position on film coverage and film cooling effectiveness were investigated and compared with a single cylindrical hole. The rotating speed was 600 r/min.The blowing ratio varied from 0.3 to 2.5 and the mainstream Reynolds number was 3370. Results show that the two anti-vortex holes both have excellent film cooling performance and perform obvious improvement than the cylindrical hole both on the pressure side and suction side. The small hole position has an important influence on the film cooling performance of anti-vortex hole. The upstream anti-vortex hole performs best at M1.5. The middle stream anti-vortex hole demonstrates good film cooling performance at a wide range of blowing ratio,and it performs best at M=2.5. The film coverage and cooling effectiveness on the suction side is lower than that on the pressure side and the film deflection is more obvious on the suction side.