8ARAVAMUDHAN Srinvasa, SANTOS Daryl. Characterization of the Solder Paste Release from small stencil Apertures is the Stencil Printing Process [ J ]. Journal of Electronic Packaging,2005,127 ( 3 ) :340 - 352.
9Wu Huihui, Zhang Xianmin, Kuang Yongcong. A Real-time Machine Vision System for Solder Paste Inspection [ C ]//Proceedings of the International Conference on Advanced Intelligent Mechatronics,2008.7:206 - 210.
10Morris John R, Wojcik Thaddeus. Stencil Printing of Solder Pastes for Fine-Pitch Surface Mount Assembly [ J ]. IEEE Transactions on Componets, Hybrids, and Manufacturing Technology, 1991,14 ( 3 ) :560 - 566.