金刚石/铜在微波功率组件热设计中的应用研究

Application Research of Diamond/Copper in Solid-state Microwave Power Devices

随着军用雷达电子装备的功率和功率密度的不断增加,对微波功率组件的散热要求越来越高,传统组件材料已经无法满足日益增加的热流密度要求,对新型热管理材料的需求变得愈加迫切。金刚石/铜具有优异的热传导性能和与芯片匹配的热膨胀系数,是一种极具竞争力的可用于组件封装的热设计材料。文中对金刚石/铜在微波功率组件工程应用中面临的问题开展了相关试验研究,通过热性能仿真测试以及振动、冲击等环境试验验证了其在微波功率组件热设计中应用的可行性。

With the continuous increase of the power and the power density of military radar electronic equip- ment, the heat dissipation requirement of microwave power components becomes more and more high. Tradi- tional materials have already been unable to deal with the continuous increasing heat flux, innovative thermal management materials become necessary. As a competent electronic packaging material, diamond/copper composites have excellent performances such as high thermal conductivity and adjustable CTE. In this paper, experimental studies are conducted for the engineering applications of diamond/copper in microwave power components, the feasibility is verified by simulation tests of its thermal properties and environmental tests such as vibration and shock.