正交试验法优化导电聚吡咯驱动器制备工艺参数

Optimization of Preparation Parameters of Conductive Polypyrrole Driver by Orthogonal Test

导电聚合物具有广泛的应用前景,为制备出高性能的导电聚合物驱动器材料,现采用正交实验法对导电聚吡咯(PPy)的制备工艺参数进行优化,其中以吡咯为聚合单体,聚偏二氟乙烯(PVDF)为基材,双三氟甲烷磺酰亚胺锂(Li+TFSI-)为掺杂剂,通过磁控溅射—电化学沉积方法制备获得三层结构的聚吡咯驱动器材料.以1 V,2 V驱动电压下的位移大小为考察指标,采用正交试验法分析制备过程中电流密度、吡咯浓度、聚合时间及温度等因素对驱动器材料位移性能的影响.试验结果表明:对制备PPy位移性能影响的最大的因素是电流密度,最佳工艺参数组合为:A3B1C3D2.即电流密度可选择为0.15 mA/cm^2,吡咯浓度为0.1 mol/L,聚合温度由于影响不大可采用-25^-35℃之间的温度,聚合时间可选10 h.

Conductive polymer has a wide range of applications,in order to prepare high performance conductive polymer driver materials,the preparation parameters of conductive polypyrrole（ PPy） is optimized by orthogonal experiment.The pyrrole was used as polymerization monomer,polyvinylidene fluoride（ PVDF） as substrate and the trifluoromethanesulfonimide lithium（ Li＋TFSI-） as the dopant.The polypyrrole driver material with three-layer structure was prepared by magnetron sputtering-electrochemical deposition method. The effects of thecurrent density,pyrrole concentration,polymerization time and temperature on the displacement of the actuator were investigated by orthogonal test with the displacement of 1 V and 2 V drive voltage.The experimental results show that the most significant factor in the effect of the preparation of PPy is current density,the best process combination is the A3 B1 C3 D2.That means,the current density can be selected as 0.15 m A/cm^2,the pyrrole concentration is0.1 mol/L,the polymerization temperature due to the impact can be used between-25 ℃ ～-35 ℃ temperature,polymerization time optional 10 h.