钉头法倒装焊技术在声表面波器件生产中的应用

The Flip Chip Bonded Technology in Surface Acoustic Wave Components in Production of the Application

简单介绍了集成电路采用的封装形式,对钉头法倒装焊技术在声表面波器件中的应用和发展趋势进行了简单分析。详细介绍了倒装焊技术在声表面波器件生产中的应用方法,对比了线焊技术和倒装焊技术的差异,介绍了倒装焊技术的优点。简单介绍了倒装焊技术的整体流程,对生产过程中的每道关键工序做了详细的描述,并对产品后期的失效形式做了简要分析。

The paper briefly introduces the encapsulation form of integrated circuit, and briefly analyzes the application and development trend of flip chip welding technology in surface acoustic wave device. The application of flip chip technology in surface acoustic wave device is introduced in detail. The difference between wire bonding technology and flip chip welding technology is compared, and the advantages of flip chip welding technology are introduced. The whole process of flip chip technology is briefly introduced. Each key process in the process of production is described in detail, and the failure forms in the later stage of the product are analyzedbriefly.