真空烧结粘片芯片脱落失效分析

Analysis of Chip Shedding Failure in Vacuum Sintering Chips Sticking

在军用电子元器件的生产加工过程中,有时由于芯片背金工艺的异常会使封装过程中粘片工艺产生缺陷,导致芯片粘接性能异常,封装成品率降低。某型集成电路,由于芯片加工背金厚度没有达到工艺要求,引起真空烧结粘片后芯片脱落失效。从电路芯片背金与钎焊料熔融状态出发,使用先进的物理分析技术及设备仪器进行失效分析,定位到引起芯片脱落失效的原因是芯片背金厚度存在缺陷。最后通过增强背金工艺监控,降低工艺缺陷,解决了该电路芯片粘接性能异常的问题,改善了封装成品率。

In the process of military electronic components production and processing, sometimes theabnormality of chip back gold process will make the chip bonding process defects in the packaging pro-cess, resulting in abnormal chip bonding performance, and packaging yield is reduced. For a certain typeof integrated circuit, because the thickness of the chip back gold processing does not meet the process re-quirements, the chip fails due to falling off after vacuum sintering chips sticking. Base on that meltingstate of the circuit chip back gold and braze material, the failure analysis is carried out by using ad-vanced physical analysis technology and equipments and instruments, and the cause of the failure of chipfalling off is located to the defect of the chip back gold thickness. Finally, by enhancing the back goldprocess monitor, reducing the process defect, the problem of abnormal bonding performance of the circuitchip is solved, and the packaging yield is improved.