摘要
采用三因素三水平正交试验,研究环氧酚醛涂料不同膜厚,不同一烘温度及过烘温度对钝化电流电量密度为70/115 C/ft^2、镀锡量为2.8 g/m^2的镀锡基板附着力的影响。使用涂层脱落量评价附着力的优劣,并使用XPS对镀锡板钝化膜结构进行分析。结果表明:膜厚对附着力影响最大,过烘温度影响次之,一烘温度影响最小;钝化膜中Cr(OH)_3含量较高是其附着力较低的原因。试验结果为下游印铁厂印铁工艺调整提供了依据。
The three-factor three-level orthogonal test was used to study the effects of epoxy phenolic resin coating with different thicknesses,different first baking temperatures and second baking temperatures on the the adhesion of tin plate with passivation current density of 70/115 C/ft^2 and the plating rate of 2.8 g/m^2.The weighting loss of coating was used as a criterion to evaluate the adhesion,and the structure of the passivation film of tin plate was analyzed by XPS.The results showed that the film thickness had the greatest influence on the adhesion,followed by the second baking temperature and the first baking temperature.The higher Cr（OH）_3 content in the passivation film is the reason of its lower adhesion.The research provides the basis for coating process adjustment of the downstream printing factory.
出处
《河北冶金》
2018年第1期34-37,共4页
Hebei Metallurgy
基金
河北省科技计划
编号16211015D
关键词
环氧酚醛涂料
镀锡板
附着力
正交试验
烘烤温度
epoxy phenolic resin coating
tinplate
adhesion
orthogonal test
baking temperature
