热固性聚酰亚胺树脂成型工艺研究进展

Research progress of moulding process for thermosetting polyimide resins

热固性聚酰亚胺树脂是指分子主链结构中含有酰亚胺环的一类高分子材料,固化后不被溶解,也不被熔融,只能一次热成型。综述了热固性聚酰亚胺树脂的3类成型工艺方法:热模压成型、热压罐成型和冷压烧结成型,根据所用原料单体的不同,其成型温度、成型压力、成型时间均有所不同。这3类成型方法各有优缺点,但均属于外部热辐射成型工艺,可能会造成聚酰亚胺制品局部受热不均匀的现象,作者提出了一种通过电磁波工艺促进聚酰亚胺分子链运动摩擦实现内部均匀温升再成型的设想。

Thermosetting polyimide resins were polymer materials with repetitive structure(—C—N—C—).They could not be dissolved and melted after cured,but just be moulded by one-time thermoforming.There were three kinds of moulding process for PI:hot press moulding,autoclave moulding,and cold press and sintering,and the moulding temperature,pressure and time were changing by different raw monomer.These three kinds of moulding process had merits and demerits respectively.There were phenomenon of non-uniform heating on PI product,because the moulding process belong to external heating radiation.A new idea of moulding process for thermosetting PI by promoting chain movement with electromagnetic wave was put forward.