红外探测器组件封装中的引线特性研究

Research on Characteristics of Wires for Infrared Detector Packaging

引线互联是红外探测器封装的关键工艺之一,而采用何种引线则会直接影响红外探测器组件的电学、力学和热学性能。引线互联需要考虑引线的材料、线径、长度和引线工艺,因而红外探测器封装中通过采用多种引线来满足不同需求。系统介绍了红外探测器封装所用引线的电学、力学和热学性能,重点测试和分析了金丝、硅铝丝、铂金丝等引线在大气和真空环境下的熔断电流。大气环境下引线的熔断电流明显大于真空环境下,并与经验公式的结果基本一致。该研究可为航天用红外探测器封装的引线选择提供参考。

Wire bonding is one of the key technologies of infrared detector packaging.However,the choice of wires may directly affect the electrical,mechanical and thermal properties of infrared detector modules.Because material,material diameter,material length and lead process need to be considered in wire interconnection,a variety of wires are usually used to meet different demands in the packaging of infrared detectors.The electrical,mechanical and thermal properties of the wires of infrared detector modules are presented systematically.The burn-out current of gold wire,silicon aluminum wire,platinum wire and other wires in atmospheric and vacuum environment is especially tested and analyzed.The burn-out current of wires in atmospheric environment is significantly greater than that in vacuum environment.This result is consistent with the empirical formula substantially.The research is of referential value to the packaging of space infrared detectors.