摘要
硅材料的发展势头依然强劲,但要将硅扩展到一些新市场和新工艺节点变得越来越困难。对于一些节点来说,CMOS已经走到尽头了,这在每个新节点上都变得更加明显。未来的发展将取决于新的材料。这为许多包括石墨烯、2D材料和碳纳米管在内的新选择打开了大门。其中一些材料本身就可以得到直接应用,而另一些将与硅材料结合,以延长摩尔定律,提高性能、功率和面积,最终远远超过目前的水平。
Silicon is still going strong, but it is getting more difficult to extend silicon into some new markets as well as new process nodes. CMOS has been running out of steam for several nodes, and that becomes more obvious at each new node.The future will depend on new materials. That opens the door for a variety of new options, including graphene, 2D materials, and carbon nanotubes. Some of these materials will be used on their own, while others will be combined with silicon to extend Moore’s Law and improve performance, power and area far beyond where it is today.
出处
《集成电路应用》
2018年第2期57-59,共3页
Application of IC
关键词
集成电路制造
半导体材料
石墨烯
碳纳米管
integrated circuit manufacturing, semiconducting materials, graphene, carbon nanotubes