摘要
RFID芯片产业化过程中,根据应用需求采用了不同封装形式,使得电气连接点pad形成多种样式。本文对RFID芯片电气连接点的基本形式进行了分析,结合芯片封装案例重点分析Bump工艺和pad再分布工艺,同时给出两种工艺各自的优缺点,阐明两种pad工艺所适用的其他标签加工环节,最后给出RFID芯片pad封装适合后续应用环境的参考工艺。本文对各种应用环境需求及后续工艺的要求的RFID芯片pad封装形式之选择具有一定的参考作用。
The chip needs to be packaged in many forms for RFID chip industrialization according to the application requirements. So that pad is formed many patterns. In this paper, the RFID chip pad basic forms are analyzed. In combination with the case of chip packaging, the Bump process and Enduro process are analyzed with emphasis. The advantages and disadvantages of the two processes are Finally, the RFID chip pad package reference process application environment and process requirements, packaging selection. given. The applicability of the two pad processes is elucidated. suitable for subsequent process is given. In view of the different this paper has a certain reference function for RFID chip pad
出处
《中国集成电路》
2017年第12期76-81,共6页
China lntegrated Circuit
