摘要
作为一种新型的加工手段,激光在印制电路板导通孔微小化和导线精细化方面的作用日益凸显。本文主要介绍了激光技术在高密度互连板生产中两种典型的应用,激光钻孔和激光直接成像,并分别阐述了其加工的原理、工艺方法及加工特点,并结合试验结果,对激光直接成像的精度进行了定量评测。
As a new processing method, laser promotes the technology of the micro vias and fine lines Two typical applications of laser, Laser Drilling and Laser Direct Imaging are introduced in this paper, and the mechanisms, process, and machining features are discussed as well. The precision of Laser Direct Imaging is evaluated by experimental results.
出处
《印制电路信息》
2018年第2期36-41,共6页
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