摘要
对微波多层器件用多种型号聚四氟乙烯介质覆铜箔基板材料进行了性能及特点介绍。运用多种针对聚四氟乙烯介质多层化的粘结材料,并对制造过程所涉及的层间定位、多层化制造工艺、孔金属化实现等关键技术,进行了阐述,实现了X波段微波多层电路板的可靠性制造。
The poly tetra-fluoroethylene microwave laminates which applied to antenna unit of microwave devices was briefly introduced regarding properties and benefits in this paper. Besides using many kinds of bonding materials for multilayer, the key technologies of registration in the press of multilayer as well as plating through hole were introduced. The microwave printed circuit board of antenna units was successfully manufactured.
出处
《印制电路信息》
2018年第2期42-45,共4页
Printed Circuit Information
关键词
微波器件
制造工艺
粘结材料
Microwave Devices
Processing Technology
Bonding Materia
