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PN结型器件在交流小信号下的电容特性 被引量:4

Capacitance characteristics of PN junction devices under AC small signal
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摘要 GaN基发光二极管(LED)是典型的PN结型器件,本文以GaN-LED为例,系统阐述了PN结在交流小信号下的电容特性;首次区分、定义了‘电压区间',并阐明了不同‘电压区间'对电容起贡献的机制.指出:小电压下,PN结电容主要由耗尽层电容贡献,随电压几乎不发生变化;过渡区,PN结电容主要由扩散电容贡献,随电压近e指数增加.这些特性与经典Shockley理论一致.大电压下,PN结电容变为负值.精确分析负电容特性后,总结出了负电容随电压和频率的精确变化关系式.负电容的实验结果难以被经典Shockley的扩散电容理论解释,但为Hess教授的《Advanced Theory of Semiconductor Devices》提供了有力的实验基础,将为半导体器件物理的发展起到推动作用. GaN-based light-emitting diode( LED) is a typical PN junction device. In this paper,GaN-LED is taken as an example to illustrate the capacitance characteristics of PN junction device under AC small signal. We have precisely pointed out the physical mechanism contributing to the total capacitance in different forward bias voltage intervals. Under a small forward bias voltage,the total capacitance of the PN junction is mainly contributed by the depletion layer capacitance. With the increase of the voltage,the total capacitance of the PN junction is mainly contributed by the diffusion capacitance. It increases with the voltage near an e-index. These characteristics are consistent with the classic Shockley theory that PN junction capacitance consists of depletion layer capacitance and diffusion capacitance. At large voltages,the PN junction capacitance becomes negative,which is defined as negative capacitance( NC). After accurately analyzing the NC characteristics,the empirical formula of the NC depending on voltage and frequency is summarized. The experimental results of NC cannot be explained by the classical Shockley’s theory,but it provides a strong experimental foundation for Professor Hess’ s "Advanced Theory of Semiconductor Devices",which will promote the development of semiconductor device physics.
出处 《大学物理》 2018年第1期64-67,76,共5页 College Physics
基金 国家自然科学基金(11204209 60876035) 天津市自然科学基金(17JCYBJC16200)资助
关键词 PN结 负电容 发光二极管(LED) GaN PN junction negative capacitance light-emitting diode(LED) GaN
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  • 1Donald A. Neamen. Semiconductor Physics and Devices [ M ]. Fourth Edition. Beijing: Publishing House of Elec- tronics Industry, 2011.
  • 2S.M. Sze, Kwok K. Ng. Physics of Semiconductor Devices [M]. 3th ed. Hoboken, New Jersey: John Wiley & Sons, 2007.
  • 3S. 0. Kasap. Principles of Electronic Materials and Devices [M]. Third Edition. New York: McGraw-Hill,2006:386.
  • 4程德明,胡建业,胡文新.硅功率器件P型扩散区耗尽层及耐压研究[J].硅谷,2012,5(17):85-85. 被引量:1

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