智能手机线路板中贵金属资源化价值评价

Assessment of precious metal value in intelligent mobile phone printed circuit boards ( PCBs)

为了解智能手机线路板中贵金属资源化价值,采用王水消解-ICP方法、Gompertz模型和卡内基梅隆模型分析其不同元器件中贵金属(金、银和钯)含量及其资源化价值。结果表明:贵金属主要分布在芯片和焊锡(掺杂电容电阻)中,其金、银和钯含量分别为321.6、332.01、2.86 mg·kg^(-1)和27.61、1 838.07、7.16 mg·kg^(-1)。其中,芯片中金含量最高,占到贵金属总含量的69.90%。经预测,2020年智能手机报废量约为3.06亿部,且预测芯片中贵金属资源化价值最高,约占贵金属总价值的57.70%。因此,建议对智能手机贵金属资源化回收时,芯片单独进行贵金属回收,可提高其回收效率。

With the expansive amount of the intelligent mobile phones, a great number of waste mobile phones need to be recycled and treated. As an important source of precious metals, the mobile phone printed circuit board has always been paid more attention by researchers. In order to know the recycling value of precious metals in the intelligent mobile phone, the contents of the precious metals （Au, Ag and Pd） in different components have been analyzed through the ICP method after digestion with aqua regia. The recycling value of precious metal has been estimated by Gompertz and Carnegie Mellon models. The results show that the contents of precious met- als in chip and solder （mixing capacitance and resistance） are higher than other components, in which the con- tents ofAu, Ag and Pd reach 321. 6, 332.01,2.86 mg·kg-1 and27.61, 1 838.07, 7.16 mg· kg-1, respectively. Especially, the gold content in chip is the highest, accounting for 69.90% of the total amount of precious metals. It also predicts that the amount of waste intelligent mobile phone will be approximately 306 million in 2020. The recycling value of the chip is the highest in all components, which accounts for 57.70% of the total precious metals value of all components. Therefore, chip should be recovered alone to extract valuable metals to improve its recovery rates before recycling the whole intelligent mobile phone boards.