零部件内孔镀银工艺研究

Process Research on the Silver Plating in Inner Hole of the Parts

为了保证零部件内孔镀银层厚度满足要求,减少生产中的浪费,本文选用内孔直径为35 mm,深度为30 mm的试样,系统研究了四种内孔镀银工艺:盲孔;盲孔,添加辅助电极;通孔;盲孔端增加2个d为4 mm的工艺孔。对四种工艺情况下所得镀层在孔内外的情况进行了比较,结果表明,盲端未处理,添加辅助电极的工艺效果最佳,可以提高试样的内孔电场,所得的镀层厚度可以满足要求。

In order to ensure the thickness of the silver coating in the inner hole of the parts to meet the requirements and reduce the waste in production,sample with a diameter of 35 mm and a depth of 30 mm was selected and four kinds of inner hole silver plating process were systematically studied,including blind hole; blind hole,add with auxiliary electrode; through-hole; add two auxiliary hole with a diameter of 4 mm on the blind hole. The situations of the deposited coating in and outside the hole under the four process conditions were compared. The results indicated that effect of adding auxiliary electrode possessed the best effect,the inner hole electric field of the sample could be improved,and the thickness of the depositedcoating could meet the requirements well.