导电滑环Au涂层摩擦磨损行为的分子动力学模拟

Molecular Dynamics Simulation of Friction and Wear Behaviors of Au Coating for Conductive Slip Ring

金(Au)及其合金由于优异的导电和抗氧化特性被广泛用做星载导电滑环涂覆层,本文中采用分子动力学模拟方法研究了导电滑环Au-Au涂层在不同温度和不同摩擦速度下的摩擦磨损行为,并通过设定模型局部快速升温模拟载流摩擦中电弧侵蚀的效果.结果表明:滑环环体与环刷的磨损主要为黏着磨损,温度升高会加快下压过程的界面力学响应;相对运动速度越低,磨损越严重,同时跑合后的摩擦力越大;影响摩擦磨损特性的主要原因是接触中心在温升区域中心附近时的焊接现象.研究结果为揭示Au-Au涂层的摩擦磨损性能随温度和速度变化的微观机理提供了参考依据,为我国卫星长寿命,高可靠性设计提供理论基础.

Au and its alloys have been widely used as the coating of satellite-borne conductive slip rings due to their good friction and wear properties.In this paper,the molecular dynamics simulation method was used to study the friction and wear behaviors of Au-Au coatings at elevated temperatures and different friction speeds,and the effect of arc erosion in simulated current friction was simulated by setting the local rapid temperature rise.The results show that the wear of the slip ring and the ring brush was mainly adhesive wear.Temperature increase accelerated the response of the interface force in the pressing process.The wear became more serious and the friction after the running-in period became greater,when the relative movement speed was lower.The main reason for the impact of friction and wear characteristics was the welding center in the vicinity of the center of the temperature rise.The results provided a reference for revealing the micro-mechanism of the friction and wear properties of Au-Au coatings with temperature and velocity,and the molecular dynamics simulation of arc erosion was proposed by local rapid heating.