摘要
在保证银浆施工性能相似的情况下,通过研究不同形貌特性的银粉与同一无机体系的复配,以改善正面主栅电极与焊带的机械附着力。研究表明:在粒径和振实密度相近的情况下,表面粗糙有微孔、球形度较差的S02、S03附着力较S01有明显提升;在保证印刷线型和湿重相近的情况下,由S01、S02、S03复配同一种无机体系,电极与焊带之间的附着力依次为1.8 N、2.8 N、4.2 N。
Mechanical adhesion of the front main grid electrode and solder stripe was improved by studying the silver powder with different morphological properties and the characteristics with the same inorganic system. In this paper, we use three kinds of silver powder, S01, S02 and S03. The particle size and solid density of S01, S02 and S03 are similar, surfaces of S02 and S03 are rougher than S01 and sphericity is poorer. The results show that the adhesive force of S02 or S03 is bigger than S01. While for similar print tape and wet weight, the adhesive forces between elec- trode and solder stripe of S01, S02, and S03 mixed with the same inorganic system are 1.8 N, 2.8 N, and 4.2 N, respectively.
出处
《电工材料》
CAS
2018年第1期7-11,共5页
Electrical Engineering Materials
基金
上海市闵行区科技项目(2016MH182)
关键词
正面银浆
无机体系
银粉
形貌
复配
附着力
fRont silver paste
inorganic agent
silver powder
morphology features
matching
adhesive force
