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陶瓷再修复中拆胶技术的研究 被引量:6

Study on disassembling glue joint technology in ceramics re-repairing
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摘要 在陶瓷文物修复中,常出现陶瓷拼对粘接错位、溢胶等问题,需要进行再修复。根据不同陶瓷胶粘剂的特性,研究了相应的拆胶技术,并对3件经过粘接处理的陶瓷器进行了以拆胶为主的再修复,效果令人满意。 During the glue-bonding repiring of the ceramic artifacts,the matching dislocation,glue overflow and other issues often appear,in these cases these artifacts usually need to be disassembled and re-repaired.According to the characteristics of different ceramic glues,the corresponding disassembling glue joint technology were studied.And three glue-bonded ceramics were re-repaired,including their disassembling glue joints,and the re-repaired results were satisfactory.
作者 牛飞
机构地区 深圳博物馆
出处 《粘接》 CAS 2018年第3期57-60,共4页 Adhesion
关键词 陶瓷 粘接 拆胶 ceramic bonding disassembling glue joint re-repair
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