摘要
用实验数据揭示了LED光辐射通量、加热功率及结温变化时的相互关系;给出了当驱动电流变化或环境温度变化时LED封装t_p(t_c)温度与结温的变化关系,从而找出了灯具生产企业应用、安装不当造成的光效降低,色漂移及封装失效的原因。
The relationship between the LED radiation flux,the heating power and the junction temperature change are demonstrated by experiments. In addition,the experiment data show the relationship of the LED package tp( tc) temperature and junction temperature when the driving current changes or the ambient temperature changes,so as to find out the light efficiency reduction,color drift and packaging failure caused by lighting manufacturers' improper application and installation.
出处
《照明工程学报》
2018年第1期29-33,共5页
China Illuminating Engineering Journal
关键词
结温
光辐射通量
热阻
色偏离
热管理
junction temperature
light radiation flux
color deviation
thermal resistance
thermal management
