氩等离子体处理后复合绝缘子的憎水恢复性

Hydrophobicity Recovery of Composite Insulators After Ar Plasma Treatment

针对复合绝缘子在实际运行中的老化失效问题,本文用氩等离子体模拟电晕放电,对复合绝缘子表面进行加速老化处理,用静态接触角法反映老化后复合绝缘子的憎水性恢复过程.根据小分子硅氧烷扩散模型和Fick第二定律对扩散方程进行推导,并利用指数函数对憎水性恢复过程进行拟合,给出了能量化评估复合绝缘子憎水恢复性快慢的指标——小分子硅氧烷扩散系数D,最后利用小分子硅氧烷扩散系数D研究温度因素对复合绝缘子憎水恢复性的影响.结果表明,在50℃条件下硅橡胶小分子硅氧烷扩散系数D是-50℃时的10倍.

Aiming at the aging failure of composite insulator in the actual operation,Ar plasma which can simulate corona discharge is used to accelerate the aging process of composite insulator,and the recovery process was reflected by static contact angle.The diffusion equation was derived according to low molecular weighted siloxames（LMWs）diffusion model and Fick＇s second law,then an exponential function was used to fit the recovery process of hydrophobicity,and a LMWs diffusion coefficient D was proposed to evaluate the hydrophobicity recovery rate of composite insulators.Finally,the effect of temperature on hydrophobicity recovery of composite insulator was evaluated using LMWs diffusion coefficient D.The results showed that at 50 ℃,the LMWs diffusion coefficient Dof silicone rubber was nearly 10 times than that in the same situation at -50 ℃.