射频同轴微带连接器内导体表面处理方法研究

Research on the Inner Conductor Surface Treatment of RF Coaxial Microstrip Connector

针对传统的射频同轴微带连接器内导体表面镀硬金处理方法所带来的装联方式的限制,提出了一种新的连接器内导体表面处理方法,即内导体整体镀硬金+微带端加镀软金表面处理法。该表面处理方法先进行内导体表面整体滚镀镍和滚镀硬金,再对镀硬金的内导体微带端进行挂镀镍和挂镀软金,使内导体界面部分具有接触可靠和良好的耐磨性,同时使内导体微带端接触面形成较强的金属键具有优良的可键合性能和连接的牢固度,可采用新的键合技术与外部连接,从而提高了连接器的性能、应用灵活性和可靠性。该表面处理方法使射频同轴微带连接器产品应用范围更广、通用性更强、更适用于航空航天领域。

Aiming at assembly mode limitation of traditional surface treatment of being plated hard gold on inner conductor surface for RF coaxial microstrip connector,a new inner conductor surface treatment is put forward.That is plating hard gold on the inner conductor entirely and plating soft gold on the microstrip end of inner conductor.To make the inner conductor interface with contact reliability and good abrasion resistance performance,the inner conductor surface is barrel plated with nickel and hard gold entirely.To make the microstrip end contact surface form stronger metallic bond with good bonding ability,connection firmness,and connecting with other devices using new bonding technique,the microstrip end is rack plated with nickel and soft gold.Thus the performance,application flexibility and reliability of the connector are improved.The new surface treatment makes the connector more widely used,more universalizable and more applicable to aerospace field.