入耳式耳机腔体结构的模型与优化

The simulation of frequency response of in-ear headphones

耳机的频响是由单元和腔体结构共同决定的。现有的耳机腔体结构仿真多采用集总参数模型,这类模型在高频段存在缺陷。该文在入耳式耳机的腔体结构仿真中引入基于传输线理论的声学模型,与传统模型相比,考虑损耗的传输线模型可提高入耳式耳机5 kHz～10 kHz频响仿真的准确性。在此基础上,优化算法提出改善耳机中高频频响的出声管设计方法。

The cavity structure of insert earphones will affect the frequency response. The existing earphone structure simulation model is mainly based on the lumped-parameter model. To improve the simulation precision of the lumped-parameter model in high frequency range, the simulation of the cavity structure based on the transmission line model is proposed. The results show that the simulation based on the transmission line model is closer to the measured results than lumped-parameter model ranging from 5 k Hz to 10 k Hz. Based on the model, the optimization algorithm is proposed to improve the design of the high frequency response of the headphone.