基于硫代硫酸盐铜乙二胺浸金体系铜及乙二胺影响电化学研究

Electrochemical Study on Copper and Ethylenediamine Effect Based on Gold Leaching in Copper-Ethanediamine-Thiosulphate Solutons

采用方波伏安法和循环伏安法对硫代硫酸钠乙二胺铜浸金体系电化学行为进行分析,试验证明采用金电极可以得到金的溶出峰、铜和硫代硫酸钠的还原峰,探究了铜离子、乙二胺及添加剂对金的溶出的影响。研究结果表明:当铜的浓度为0.004 mol/L时,金的溶出峰最大;当乙二胺(en)浓度为0.06 mol/L时,金的溶出峰最大;适度的EDTA对铜离子有稳定作用,可提高金的溶出。

Using square wave voltammetry（ SWV） and cyclic voltammetry（ CV） analysis Na_2S_2O_3 and ethylenediamine electrochemical behavior of copper gold leaching system. Experiment shows that the stripping peak of Au was received,and reduction peak of copper and Na_2S_2O_3 by using gold electrode.The influence of additives,Cu^（2＋） and ethylenediamine on the dissolution of Au was explored. The results showed that stripping peak of Au was the largest when concentration of copper was 0. 004 mol/L and ethylenediami was 0. 06 mol/L. Mild EDTA has stable effect on copper ions. It increases the dissolution of Au.