摘要
砂轮划片和激光划片是硅晶圆的两种主要划片方式,从理论和工艺试验两个层面,分析了两种划片工艺的优缺点,提供了一种适合硅晶圆划片的砂轮与激光复合划片工艺方案,给出工艺参数和测量数据,具有很好的工程应用价值。
Grinding wheel dicing and laser dicing are mainly introduced silicon wafer dicing ways.According to theoretics and technical experiment,the paper analyzes advantages and shortages of two dicing technics,including technical parameters and measuring data. Providing a technical method of Grinding wheel and laser multiple dicing for silicon wafer,it is very valuable for industry application.
出处
《电子工业专用设备》
2018年第1期25-28,68,共5页
Equipment for Electronic Products Manufacturing
关键词
砂轮划片
激光划片
硅晶圆复合划片
Grinding wheel dicing
Laser dicing
Silicon wafer multiple dicing
