解决高级半导体封装应用难题的临时接合技术发展

Evolution of Temporary Bonding Technology to Address Challenges in Advanced Semiconductor Packaging Applications

薄晶圆处理(TWH)技术的应用在逐渐增长和多样化,该技术将设备基材临时接合到支撑载体上。TWH技术广泛用于高级半导体封装的应用中,例如用于制造具有TSV、3D-IC和扇出型晶圆级封装的2.5-D中介层。临时接合技术已得到成功运用,可以在这些高级封装形式的制造过程中,对常见的所有背面加工中的薄基材进行处理。在解决每项应用中独特难题的过程中,引入了多代的粘合剂接合材料和新的接合与分离(剥离)技术。回顾了TWH技术的发展,并对加工的要求和复杂性(可对选择的接合材料与剥离方法进行界定)进行说明。

The applications are diverse and growing for thin wafer handling（TWH） technology,which utilizes the temporary bonding of a device substrate to a supporting carrier. TWH has found widespread application in advanced semiconductor packaging,such as for the fabrication of 2.5-D interposers with TSVs, 3 D-ICs and fan-out wafer-level packages. Temporary bonding technology has been used successfully for the handling of thin substrates in all of the backside processes commonly encountered in the fabrication of these advanced package forms. Several generations of adhesive bonding materials and new bonding and separation（debonding） techniques have been introduced along the way to meet the challenges that are unique to each end application. In this article,we will review the evolution of TWH technology,along with the processing requirements and intricacies that define the selection of a bonding material and debonding method.