摘要
根据集成电路晶圆的不同用途,分析了晶圆减薄后残留的污染物对后续工艺的影响,介绍了晶圆减薄机内部集成的清洗系统,并根据清洗目标,提供了一套完整的清洗方案。
According to the different application of IC wafers, the effects of residual contaminants after grinding on the subsequent process are analyzed in this paper. A cleaning system integrated in the grinding machine is introduced, and a complete cleaning solution is provided according to the cleaning target.
出处
《电子工业专用设备》
2018年第1期45-47,56,共4页
Equipment for Electronic Products Manufacturing
关键词
晶圆
减薄后
清洗系统
Wafer
Post grinding
Cleaning system
