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双氰胺与噁唑烷酮环氧树脂体系固化动力学 被引量:1

The Curing Kinetics of the Curing System of Dicyandiamide and Oxazolidone Epoxy Resin
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摘要 采用非等温DSC法对双氰胺固化剂与噁唑烷酮环氧树脂和双酚A环氧树脂混合树脂体系固化动力学进行了研究,随着升温速率的增大,固化反应放热量急剧增加,而且固化体系的放热峰向高温方向移动。采用T-β外推法,得到了混合固化体系的特征温度,Ti为156℃,Tp为178℃,Tf为210℃,为实践中的固化工艺提供了重要依据。采用Kissinger、Crane和Arrhenius方程,计算了固化反应的表观活化能为130.86k J/mol、反应级数为0.9443和固化反应速率常数,确定了固化反应的动力学方程。 The curing kinetics of the curing system which were composed of dicyandiamide and oxazolidone epoxy resin and bisphenol A epoxy resin were investigated by the non-isothermal DSC methods. The curing exothermic peak gradually got steeper and shifted to a higher temperature with the increasing of heating rate. According to the T-β extrapolation, the characteristic temperatures of each curing systems were determined which would provide an important basis for the practical curing process, the Ti, Tpand Tfwas 156℃, 178℃ and 210℃ respectively. The apparent activation energy was 130.86 k J/mol and the reaction order was 0.9443. The rate constants and kinetic equation of the curing reaction were calculated by Kissinger, Crane and Arrhenius equation.
出处 《化学与粘合》 CAS 2018年第1期5-8,共4页 Chemistry and Adhesion
基金 天津市科技计划项目(编号:15PTYJGX00040)
关键词 双氰胺 恶唑烷酮 环氧树脂 固化动力学 Dicyandiamide oxazolidone epoxy resin curing kinetics
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