摘要
鉴于LTCC表面形貌对多芯片组件元器件安装和微波信号传输的重要影响,分析了层压过程中隔离膜、金属掩模板和嵌件对表面形貌的影响规律。工艺实验结果表明,优选的隔离膜材料可以降低LTCC介质及导体表面粗糙度。通过金属掩模板可以改变层压压力分布状态,等静压到单轴静压的转变可以有效降低导体电路图形凸起。嵌件的应用可以有效提高腔体层压保形能力。
The influences of the isolation film material,metal mask plate and insert material in the laminating process were analyzed respectively because the LTCC surface topography has a great effect on the Installation of electronic components and transmission of microwave signal in the multichip module.The engineering test shows that the preferred isolation film material can reduce the surface roughness of LTCC dielectric as well as electric conductor.The pressure distribution can be changed from isostatic to uniaxial static pressing and the circuit graphics bulge can be decreased through the metal mask plate.Moreover,the application of insert material can increase the holding ability of cavity deformation.
出处
《电子工艺技术》
2018年第1期15-18,36,45,共6页
Electronics Process Technology
基金
装备预先研究项目(项目编号:41423010608)
关键词
低温共烧陶瓷
层压
表面形貌
low temperature co-fired ceramics
laminating process
surface topography
