MMIC芯片的散热技术研究

Research on Heat Dissipation Technology of MMIC Chip

近年来,随着微电子技术的飞速发展,MMIC(单片微波集成电路)芯片的散热需求提高到了前所未有的高度。采用热阻参数并不能准确表示MMIC芯片的热特性,通过计算和仿真发现MMIC芯片的热阻受载体材料的热导率影响。改善MMIC芯片的热特性应采用超高热导材料作为芯片载体。金刚石因其超高热导率、高载流子迁移率等优异性能而最有希望成为下一代MMIC芯片的散热载体材料。

In recent years,with the rapid development of microelectronics technology,the heat dissipation demand of MMIC chip has increased to an unprecedented height.The thermal performance of the MMIC chip cannot be accurately represented by the thermal resistance.Simulation indicates that the thermal resistance of the MMIC chip is affected by the thermal conductivity of the chip carrier.In order to improve the thermal performance of the MMIC chip,the materials with high thermal conductivity should be used as the chip carrier.With its high thermal conductivity and high carrier mobility,diamond has the best hope of becoming the heat dissipation material for the next generation of MMIC chip.